General-purpose relays should continue to develop in the direction of small, thin and molded. Low height, high sensitivity, and high reliability relays for printed circuit boards are still the mainstream products in the general purpose relay market. The market for reed relays continues to expand, and products should move from open type to plastic sealed. High I/O insulation of plastic sealed reed relays is attracting attention. Solid state relays will become more widely used, and products should be developed in the direction of high reliability, small size, high resistance to inrush current impact and high anti-interference. Military relays should be developed in the direction of dual-use for military and civilian use. TO-5 relays and 1/2 crystal hood relays compatible with IC are still the focus of the small sealed relay market development, but should be developed in the direction of high environmental adaptability and high reliability. There is still a market for multi-contact groups and large load dual purpose relays.

Relays should continue to be miniaturized and piecewise in size and form factor. Function should be developed from a single switch function of the traditional relay to combined relays, assembly technology should be SMT (surface mount) to micro assembly (MPT), microelectromechanical systems (MEMS) direction.