Relays should continue to be miniaturized and chip-based in volume and form factor. Functionality should be developed from single switch function traditional relays to combined relays, assembly technology should be developed from SMT (surface mount) to micro assembly (MPT), microelectromechanical systems (MEMS) direction.

General-purpose relays should continue to develop in the direction of small, thin and plastic. Low height, high sensitivity, and high reliability relays for printed circuit boards are still the mainstream products in the general purpose relay market. The reed relay market continues to expand, and products should be developed from open type to plastic sealed direction. High I/O insulation of plastic sealed reed relays is attracting attention. Solid state relays will become more widely used, and products should be developed in the direction of high reliability, small size, high resistance to inrush current impact and high anti-interference. Military relays should be developed in the direction of dual-use for military and civilian use. TO-5 relays and 1/2 crystal hood relays compatible with IC are still the focus of the small sealed relay market development, but should be developed in the direction of high environmental adaptability and high reliability. There is still a market for multi-contact groups and large load dual-use relays.